One where other OEMs that don't have access to SLP technology and components will have a hard time catching up with.
The new S8 Active model loses the edge-to-edge screen design of the standard models, which is a key selling point of the device, in favor of a frame for improved durability.
The report further noted that "As Apple and Samsung Electronics, which are leading global Smartphone markets, decided to start using SLP for their upcoming Smartphones, main board manufacturers for Smartphones are set to face catastrophic impact". This indicates that batteries need to get bigger while boards need to get smaller, SLP is seen as an element that can satisfy both conditions at the same time.
If Samsung nails this technology and manages to make a major breakthrough with its battery life, the company could always decide to only provide an Exynos version of the next flagship phone.
About Making Comments on our Site: Patently Apple reserves the right to post, dismiss or edit any comments. Using the SLP will make more space for the battery.
The substrate-like PCB board is a more advanced iteration of the existing HDI circuit board. As number of demands for TSPs that were supplied from outside is starting to disappear, size of related markets for parts and materials is expected to be reduced. Latest reports indicate that the Galaxy S9 will not feature an under-display fingerprint scanner. Sources told the publication that the Samsung would expand the application of SLP "once the initial introduction phase of SLP passes by". PCB manufacturers are expected to see the same trend as Samsung switches to SLP.
According to the Korean media ETNews, Samsung is going to push some boundaries next year. Y-OCTA combines the touch function and the display into a single manufacturing process.
There's a benefit to this change.
The Galaxy S9's motherboard may be stacked per industry insiders.